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EDUCATION: Ph.D, Dept of Mechanical Engineering, Marquette University, Milwaukee, Wisconsin, USA (1985).
(Thesis on "growth kinetics of second cellular reaction in Aluminum-59.5 at pct Zinc alloy".)
M.Tech..(Materials Science), Indian Institute of Technology, Kanpur, India (1979).
(Dissertation on phase transformation and magnetic properties of RE-Co based alloys)
B.E. (Metallurgical Engineering)-First Class, University of Calcutta, India (1977).
(Dissertation on full mold casting of Aluminum-2% Cu alloy used in aerospace).
PROFESSIONAL
ENGINEER Registered Chartered Engineer of The Institute of Materials, UK since 1997.
EXPERIENCE: July 2006- Present: Materials Res Engineer (Permanent position). Materials Testing and Evaluation Laboratory, DOD, USA. Managing the laboratory.Working on metallurgical failure analysis, mechanical properties, metallographic specimen preparation and microstructural analysis of different components of ships, submarines and pipes, valve assemblies(different steels, C-Ni, Cu-Ni-Al, K-monel, Brass, Bronze and other non-ferrous alloys) using optical microscopes, x-ray and SEM and EDS. Doing corrosion testing/ passivation of different ferrous, CUNI and Stainless steel parts. Also carry out weld defect and alpha ferrite measurent and analysis. Doing mechanical testing, impact testing and analysis of metallurgical(both ferrous and non-ferrous) components and sheet metals, tubes using Baldwin, Instron,Charpy, Microhardness, Rockwell, Brinell and other machines.Familiar with MIL, ASTM and other standard specifications. Also working as NDT Inspector for metallurgical welds, other parts for ships, pipes etc. Also sometimes work as Corrosion Engineer.
May 1995- August 2001: Senior Lecturer of Materials Engineering, School of Applied Sciences, Nanyang Technological University, Singapore.
Taught such courses as (i) Microelectronic Packaging (ii) X-ray Diffraction, Scanning Electron Microscopy and Other Analytical Techniques (iii) Electronic and Magnetic Properties of Materials (iv) Materials Science (v) Ceramics(vi) Mechanics (vii) Manufacturing processes.
Also taught (i) Materials Processing II (covers welding, Fe-C diagram, T-T-T diagram, mechanical behavior of metals etc) at the School of Mechanical and Production Engineering, NTU. Supervised two (2)) Master's students.
Carried out research using, SEM, EDAX, XRD, TGA, TMA, DILATOMETER, INSTRON for metallurgical phase and failure analysis.
April 1994-April 1995: General Manager-Technology Development, TATA-ACC Ltd, Calcutta, India.
I was responsible for managing a ferrite plant and improved formulations of Fe-Mg, Fe-Mn –based ferrites and process yields (by innovation) of ferrite cores for high frequency transformers for aerospace.
April 1990- March 1994: Research Ceramist(Dielectrics and Coating Materials), Ferro Corporation, Electronic Materials Division, Santa Barbara, CA, USA.
Was responsible for developing and inventing thick film dielectric materials for aerospace and automotive industries.. Invented several low k and medium k thick film dielectric materials and low temperature co-fire ceramic /plastic composite tapes (LTCC) for application in hybrid and microwave circuits.
Inventor of the only ceramic dielectric material for AlN super-multilayer high performance hybrid circuit compatible with gold and silver conductors. Awarded a major US patent. Also worked as a team member of the group developing AlN "green tape" with the lowest insertion loss for high frequency (>40 GHz) microwave application in phased array radars in aerospace. Invented large number of glass-ceramics based coating materials also. All these products are being sold worldwide by a major US Company.
Used XRD, EDAX, SEM, DEKTAK, MICROTRACK etc.
September 1988- March 1990: Senior Development Engineer(Dielectrics/Coating), Ferro Corporation, Electronic Materials Division, Santa Barbara, CA, USA.
Developed a large number of sealing pastes,thick film dielectric materials and conductors for hybrid circuits.
July 1987- July 1988: Assistant Research Engineer, Materials Research Laboratory, University of California, Santa Barbara, CA, USA. Worked on the processing and microstructural investigation of Nb-Ti, Nb-Si based aerospace alloys for future synthesis of these phases in space under a contract from NASA and DOD.Used SEM, DTA, EDAX, TEM.
March 1986- July 1987: Postdoctoral Research Associate, Materials Engineering Division, University of Florida, Gainesville, FL, USA. Worked on processing of similar type of aerospace alloys as in the University of California.Used TEM, SEM, EDAX, ELETRON MICROPROBE for analysis.
August 1983-Feb 1986: Instructor and Laboratory Supervisor (Electron Microscopy Laboratories), I was in charge of several TEM and SEM laboratories. Taught an undergraduate course, "Materials Science".Used EDAX, SEM and TEM.
PUBLICATIONS
Journal:
1. G. Sarkar, S. Mridha, D. Xie and S.N. Mukherjee, " Laser Assisted Pb-Sn Solder Bumping of PCB", accepted by Journal of Materials Engineering and Technology,. Elsevier Publication, Netherlands, July 2004.
2.G. Sarkar, A. Wee, S. Masrena and M. Kuo, "Effect of Thermal Cycling on the Solder Joint Reliability of Ball Grid Arrays", Journal of Mat. Sci. L.21, pp.61-63, 2002.
3. A.S. W. Wong, R. Gopalakrishnan and G. Sarkar, " XPS and AES investigation on the oxidation resistance of plasma treated copper leadframe", J. Vacuum Science and Technology A., 18(4), pp.1-13, July/Aug 2000.
4. A. Wong, G. Sarkar and R. Gopalakrishnan, " Chemical and Structural Studies of the Oxidation Resistance of Plasma Treated Copper Leadframe", accepted in the Journal of Electrochemical Society, Jan, 2004.
5.G. Sarkar, S. Mridha, Y.T. Wu and C.K. Sem, " Flip Chip Interconnect Using Anisotropic Silver Conductive Adhesive", The Journal of Materials Processing Technology, Vol. 89-90, pp. 484-490,1999
6.G. Sarkar and B.K. Hong, "Adhesion of Sputtered Copper to Photosensitive Epoxies", Journal of Materials Science Letters, Vol. 18, pp. 991-994, 1999.
7.G. Sarkar, Y.F. Chong and P. Collier, "A Study of the Factors Affecting Surface Insulation Resistance (SIR) Measurements", Journal of Materials Science Letters, Vol. 17, pp. 1963-1965, 1998.
8.G. Sarkar, Y.F. Chong and P. Collier, "A Cleaning Process for Flip Chip Assemblies Before Encapsulation", Journal of Materials Science Letters, Vol. 18, pp.63-65, 1999.
9.A.B.Gokhale, G.Sarkar, G.J.Abbaschian, J.C.Haygarth, C.Wojcik and R.E. Lewis, "Supercooling Effects in Eutectic and Off-eutectic Nb-Si Alloys", Jounal of Materials, vol 39, No. 7, A69-A70, July 1987.July 1987.
10.C.F. Yang, G. Sarkar and R.A. Fournelle, "Discontinuous precipitation and coarsening in Al-Zn Alloy", Acta Metallurgica, Vol 36, No. 6, pp. 1511-1520, 1988.
11.E.M.T.Velu, G. Sarkar, E.C. Subbarao H.O.Gupta, K.P.Gupta, S.N. Kaul, A.K. Majumdar, R.C.Mittal, T.A.P. Sankar, M.V. Satyanarayana, K. Shankaraprasad, and J. Subramanaium, "Phase relations in the Mischmetal-cobalt systems", Journal of Less Common Metals, Vol 71, pp. 219-234, 1980.
12. T.A.P. Sankar, H.O. Gupta,G. Sarkar, E.C. Subbarao, K.P. Gupta, N.R. Bonda, D.K. Goel, S.N. Kaul, A.K. Majumdar, R.C. Mittal, M.V.Satyanarayana, K. Shankaraprasad, J. Subramanium and E.M.T. Velu, "Analytical methods of RE-Co Alloys", Bulletin of Materials Science, Vol. 2, No. 3, pp. 167-176, 1980.
13. R.C. Mittal, M.V. Satyanarayana, K.P.Gupta and G. Sarkar, "Phase equilibria and Magnetic Characteristics of Phases in the MM-Co-Fe System at the High Transition Metal Side", IEEE Transaction on Magnetics, Vol 25, No.6, pp. 1775-1777, 1979.
14. G. Sarkar, "Glasses for Hybrid Microelectronic Packages", SAS Research Link, Nanyang Technological University, Singapore, No. 3/97, p.24, 1997.
15.C.S. Chee, R. Fung, C.Y.Lie and G. Sarkar, "The Reactive Pre-cleaning in Copper Metallization for Deep Sub-micron (<0.18 mm) Nano Device", Proceedings of SPIE-ISMA 2000 Conference, Singapore, Nov 2000.
16. C.H. Seah, S. Mridha, G. Sarkar and L.H. Chan, " Trench and Via Filling With Electroplated Copper: Effect of Current Density and Pulse Waveform", Proceedings of MRS Spring –2000 Meeting, San Francisco, CA, April 24-28, 2000.
17. R. G. Krishnan, A. Wong, G. Sarkar, K. Nyunt and T.C. Chai: " Plasma nitridation on commercial copper leadframe for Cu/EMC adhesion", Proceedings of INTERPAK 99, Hawaii, USA, vol 1, pp. 773-779, 1999.
18.G.Sarkar,'Synthesis and Analysis of Plasma Nitrided Commercial Copper Leadframe", Proceedings of AMD Technical Forum, July 16, 1999.
19. Kuo Min, Xie Dongji, Gautam Sarkar and Tan Boon Khuan, "Microstructure and Failure Analysis of Low Cost Flip-chip Solder Joint", Proceedings of 3rd. Singapore-Japan Microelectronics Packaging Seminar, Singapore, pp.101-128, 10 July, 1998.
20. Gautam Sarkar, M.Kuo,D. Xie, S.F.Lan and B.K.Tan, "Effect of thermal ageing and thermal cycling on the reliability of solder joints of TAB outer lead bonds", Proceedings of IEEE Electronic Packaging Technology Conference(EPTC-97), Singapore, Oct 1997.
21. S. Mridha, Y.L. Foo, W.M.Kong and G. Sarkar, "Microstructural Characteristics of Two Gold Wires",International Conference on Structures, Processing and Properties of Materials SPPM-97, Nov. 15-17, 1997,pp. B11-B15,Dacca, Bangladesh, 1997.
22. G. Sarkar and A. Shaikh, "A new multiplayer thick film dielectric system for AlN substrate", Proceedings of the 96th American Ceramic Society Annual Meeting, Indianapolis,, USA, 1994.
23. A. Shaikh and G. Sarkar, "Thick film low k dielectric for high speed multiplayer circuits" Proceedings of ISHM Advanced Technology Workshop, Ojai,CA, USA, 1992.
24.G. Sarkar, K. Allison, A. Shaikh and D. Hankey, "High Reliability Silver Based Multilayer System, " Proc. of Japan IEEE/IEMT Symposium," Tokyo, Japan, 1991.
25. R.D. Gardner, A.S. Shaikh, G.Sarkar and C. Bauer, "Materials Science Aspects of a Thick Film Copper/Dielectric System", Proceedings of International Society of Hybrid Microelectronics, Chicago, USA, pp. 285-294, 1990.
26. A. Shaikh, K.Allison, G. Ackerman and G. Sarkar,"Thick Film Interfacial Interactions and Res ultant Effect on Fired Film Properties", Proceedings of International Society of Hybrid Microelectronics, Baltimore, USA, pp.576-586, 1989.
27. M. Hyman, J.J. Valencia, C. McCullough, G. Sarkar,C.C.Levi and R. Mehrabian, "Stability and Microstructural Development of Ti-Al With Boron addition", Abtract of 117th TMS-AIME Annual Meeting, Phoenix, USA, 1988.
28. G. Sarkar and R.A. Fournelle, "Discontinuous Coarsening of The Lamellar Product of the Monotectoid Al-59.5 At.% Zn Alloy", Abstract of 114th TMS-AIME Annual Meeting, New York City, USA, 1985.
Books, Mono-
graphs and Chapters:
1. G. Sarkar, S. Mridha, L.S. Guey and Y.L.Pang, " The Anodized Aluminum Film and Its Electrical Properties", Processing and Fabrication of Advanced Materials VI, Vol. 2, Ed. J.J. Moore, Institute of Materials Communications Ltd, U.K., pp. 1161-1172, 1998.
2.L. Cartz, F.G. Karioris, R.A.Fournelle, K. Appaji Gowda, K.Ramasami, G.Sarkar and M. Billy, "Effect of Heavy Ion Bombardment on The Nitride and Oxinitride Structures", of Scientific Basis for Nuclear Waste Management, Ed. John G. Moore, Plenum Press, New York, USA, pp. 421-427, 1981.
3. E.M.T. Velu, E.C. Subbarao, H.O.Gupta, K.P. Gupta, S.N. Kaul, A.K. Majumdar, R.C. Mittal, T.A.P. Sankar, G. Sarkar, M.V. Satyanarayana, K. Sankara Prasad and J. Subramanium, "The Rare Earths in Modern Science and Technology", Eds. Gregory G. McCarthy, James J. Rhynes and Heberty B. Silber, Plenum Press, New York, USA, pp. 45-50, 1980.
Patents: 1. A. Shaikh, G. Roberts and G. Sarkar, "Dielectric Materials", US Patent Office Publication, Washington D.C., Patent No. 5,397,830; 1995.
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Professional
Activities: 1.Professional Member of the Institute of Materials, UK.
2. Member of IMAPS-USA since August 2002
3. Member of MRS-USA since July 2001.
4.Member of the Committee of APACK-2001, International Conference in Microelectronic Packaging, Singapore, December 5-7, 2001.
5. Session Chair and Advisory Committee Member of International Technical Committee of GLOBATRONICS-2000, Sept 2000, International Conference on Electronic Components, Singaopore. 11-15 Sept, 2000.
6.President of International Microelectronics and Packaging Society (IMAPS), Singapore Chapter. March 1998-February 2000.
7. President-Elect of IMAPS, Singapore Chapter, March 1997-February 1998.
8. Invited Guest Speaker and Program Chair of TPPM99-First International Conference on Thermo-Physical Properties of Materials, Singapore, Nov.17-19, 1999.
9. Committee Member and Program Chair of APACK-99, International Conference in Microelectronic Packaging, Singapore, December 8-10, 1999.
10.Chairman of The IMAPS'98 –Singapore-USA Microelectronics Packaging Conference (organized by IMAPS-USA and IMAPS-Singapore), Singapore, April 28, 1998.
11. Chairman of The 3rd Singapore-Japan Microelectronic Packaging Seminar (jointly organized by IMAPS-Singapore and JIEP-Japan), Singapore, July 10, 1998.
12 Chairman of the Surface Coating Technology Session of The International Conference on Processing and Fabrication of Advanced Materials (PFAM-6), Singapore, Nov 24-26, 1997.
13. Education Secretary of ISHM-Mission Chapter, Santa Barbara, CA, USA, January 1990 – December 1992.
HONORS: 1. Marquis Who's Who of Professionals in 2005
1. Reviewer of "Journal of Materials Science: Materials in Electronics", U.K., March 2002- Present.
2 Reviewer of Journal of Electrochemical Society, Phildelphia, PA, May 2000- Present.
3. Best Use of Technology award in "Art is Science 2002" Exhibition and Campus –wide Competition in University of Alaska-Fairbanks, AK, USA, Feb 8, 2002.
4."International Reviewer" of A*STAR (previously National Science and Technology Board of Singapore Government) Strategic Research Initiative Projects in Engineering (Materials Engineering)- December, 2001- Present.
5. Selected for inclusion of biography in "Marquis Who's Who in the World-2001"(International Register of Outstanding People), 18th Edition, Marquis Publication, NJ, USA, December 2000.
6. Awarded The Certificate of Technical Excellence by Managing Board of AMD (Advanced Micro Devices) As The distinguished Guest Speaker of the 4th Technical Forum, Singapore, July 15, 1999.
7. Distinguished Speaker at The International Society for Hybrid Microelectronics (ISHM)-Evening Talk Seminar, Singapore, November 24, 1995.
8. Invited Guest Speaker at The American Ceramic Society, Southern California Chapter Annual Meeting, Orange County, CA, USA, Oct 14, 1989.
9. Invited Guest Speaker at The Annual Meeting of ISHM-Northern California Chapter, San Jose, CA, USA, Nov 30, 1989.
CONSULTING:1. July 1999- July 2000: Advanced Micro Devices Corp, Singapore; Teach modules on metals for packaging materials to the engineers involved in packaging.
2. May 1984- Nov 1984: Norton Corp, abrasives Div, Troy, NY; Analyzed abrasive coated tapes using SEM/EDAX and light microscopy and determined the extent of adhesion at the interface.
3. May 1981-Dec 1982: Milaeger Well and Pump Co, Brookfield, WI; Determined/analyzed the modes of metallurgical failures in drill bits, boiler components and shafts etc.
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