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Objective:
To obtain an engineering position preferably process engineering.
Summary:
-More than four years experience in process engineering and project management.
-International assignment in Gresham, Oregon for technology transfers.
-Well versed in DOE and statistical methods.
-Proficient with MS Office, RS1, Cornerstone, HYSIS, HYSIM.

Education:
Bachelor of Science in Chemical Engineering, May 1998
University Of Tulsa, Tulsa, Oklahoma

Courses taken included:
Process Control Heat Transfer
Mass Transfer Chemical Reactor Design
Instrumental Analysis Process Component Design
Corrosion Engineering Chemical Engineering Plant Design
Undergraduate research Equilibrium Thermodynamics

Experience:
Technical Engineer, May 2002 to present
Lord Chemical Products (M) Sdn Bhd, Puchong, Selangor

-Transformed a disorganized, inefficient warehouse into a smooth running operation by totally redesigning the stock inventory system, samples inventory systems and confirmation of new stock arrival.
-Organised customer inquiry system where an efficient database inclusive of all type of inquiries, failures and issues, action taken and recommended solution is designed.
-Provided technical assistance to customers for new product development, troubleshooting guide and better process management system.
-Acted as safety adviser to customers in assisting to be compliant with Department of Occupational and Health ( DOSH ).
-Managed customers' account as account manager. Provided forecasting for customers monthly consumption.
-Managed warehouse in terms of ensuring stocks are in proper condition prior delivering to customers.

Process Engineer – Chemical Cleaning, March 2001 to April 2002
MEMC Electronic Materials Sdn Bhd, Petaling Jaya, Selangor

-Responsible for process improvements, development and characterisation.
-Performed process and operation audits in order to ensure that all procedures compliant with ISO14001, QS9000 and ISO9000.
-Improved low yield cleaning efficiency on Low Thermal Oxide products by introducing dilute hydrofluoric acid ( HF ). This increases the yield from unacceptable level to almost 100% yield on all Low Thermal Oxide products and saved cost on reworking the affected products.
-Improved low ozone concentration in Ozonated Polished Slice Cleaner by redesigning the system from ambient temperature bath to chilled bath system. This system maintained sufficient ozone concentration level in bath and avoid low yield from the wet cleaning system. It also solved an issue that affects the yield badly when ozone concentration drops significantly.
-Introduced heated hydrochloric acid bath by doing bench-marking from sister plant is Tsukuba, Japan in order to improve metal contamination level. This had lowered the metal surface contamination on silicon wafers to significant level and maintained constantly.
-Implemented dry feed process by introducing down flow dryer after wet cleaning process. Achieved this by bench-marked process from sister plant in Japan. Particle level dropped significantly and metal surface contamination level also affected since no staging tanks needed prior to final scrubbing. Staging tanks have showed some evidence of introducing metal contamination.
-Implemented dilute SC1 and hydrochloric acid for chemical cleaning by incorporating design of experiment approaches. By this chemical cost of almost USD10,000 is saved per annum. On the same token, level of particle contamination is also improved.
-Initiated cost reduction in DI Water usage in chemical cleaning process by 33%. The quality of the products is maintained. Management suggested to have 10% savings but successfully achieved 33%.
-Tested new cleaning process by introducing hot acid cleaning systems into wet bench. Results obtained were very favourable in terms of reducing metal surface level. Metal surface contamination dropped significantly from 5E10 atoms/cm2 to 1.5E10 atoms/cm2.
-Involved in yield improvement program by implementing recycles on Edge Gathering ( EG ) products. This helps saved for at least 30% of the yield.
-Involved in troubleshooting customer complaints of EPI Staking Fault issue by interacting between sister plants and customers. Managed to narrow identify the root-cause.
-Involved in new filter evaluation by running numerous test on various products line. This was initiated due to defects on silicon wafers that were caused by improper bath filtering system.
-Experienced in running analysis tool such as ICP-MS, GC and AAS.

Process Engineer – Oxide Etch, June 1998 to February 2001
Silterra Malaysia Sdn Bhd, Kulim, Kedah

-Involved in technology transfer activities in Gresham, Oregon. Technology includes 0.35, 0.25, 0.22 and 0.18 um. Focused mainly on oxide etch process of reversed mask, contact, vias and passivation layer.
-Anticipated with technology partner team in process development and characterisation to obtain robust process window prior transferring to Malaysia. This is done by using DOE and SPC tools.
-Involved in development and improvement of tool efficiency and downtime.
-Incorporated DOE, statistical method and FMEA in process improvements and developments.
-Involved in process start-up on all oxide process for the capacity of 3000 wafer per month.
-Involved in metrology tools start-up. Metrology tools cover KLA CD SEM ad Thermawave Optiprobe for film thickness measurement.
-Performed process acceptance studies on metrology tools and process equipments.
-Involved in process and operation specification documentation.
-Solved TiN punch-thru issue by simulating the possible caused conditions. Incorporated DOE into the investigation and managed to nail down the root-cause.
-Performed process development and characterization on metallic polymer cleaning by DOE on all vias etch process. This successfully has the wet cleaning process stripped off completely the polymer discharge and improves the respective process yield.
-Experienced in operating and job creation on operating tools and metrology tools. Equipments include Prometrix, KLA-Tencor 6220 Surfscan, KLA-Tencor SP-1, Rudolph Ellipsometer, Profilometer P-30, Thermawave Potiprobe, KLA XP8100 CD SEM, LAM Exelan 4520, 9400 PTX and 9600 PTX.
-Involved in equipment interface SEC-GEMS implementation and integration.
-Undergone maintenance and operating training on LAM Research 4520 Exelan at Fremon, California.
-Undergone application training on Thermawave Optiprobe at San Jose, California.
-Familiar with photolithography processes especially in contact, via and pad process. Involved with photolithography team in developing robust via etch on 0.22 um.
- Planned and scheduled on test wafer inventory system for all process start-up and qualifications.
-Familiar and well versed with FactoryWorks and Midas Xsite.

Reference:
Available upon request.

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