Misco Jobs

Product Engineer - Development/Engineer/Semiconductor

Posted: 15 May 2008
Apply Deadline: 11 Aug 2008
Location: Mequon, WI, USA
GLOBAL MANUFACTURER of process control and automation products has an opportunity for a Senior Project Engineer to work in their facility located near Milwaukee, WI. This position will be responsible for designing semiconductor power module packaging and electronic component packaging including the areas that affect the performance and manufacturability of the products such as, materials, processes, design features. Develop processes to manufacture semiconductor power module packages and integrate them into manufacturing lines. Assume responsibility for new semiconductor power modules and electronic component packaging release to production from design phase through pilot production. Applicants must have a Bachelor of Science degree in an engineering discipline. Minimum of 5 years experience as a Project Engineer in a product development, manufacturing environment with major product development responsibility. Must have experience in development or design of power modules, hybrid circuits and 10+ years experience in process engineering. Experience is desirable in the following: material selection for electronic components; large wire bonding; soldering process experience (vacuum soldering); potting and potting materials. experience in IC package design and development for low and high power IC packages, assembly production and package qualification is very desirable; also mechanical design and analysis, thermal stress analysis, thermo-mechanical finite element modeling, electronic and microelectronics packaging, thermal management and analysis. A great work environment with benefits await the right candidate. APPLY TODAY.

Questions you will be asked:

• Describe your experience working in the semiconductor, power module packaging and electronic component industry

• Describe your experience in product development projects involving development or design of power modules, hybrid circuits or power electronic devices

• Describe your knowledge of agency approval requirements such as UL, IEC, etc as they apply to industrial power packaging

• Describe your knowledge or experience in fabrication or assembly of electronic components and assemblies

Related Words: thermo-mechanical finite element modeling, electronic and microelectronics packaging, thermal management and analysislow and high power ic packages, assembly production and package qualificationindustrial power packaging, power modules, hybrid circuits, fabrication, electronic components, wire bonding, potting, product development engineer, mrp, spc, material resource, material management, manufacturing, fabrication, apqp, advanced product quality planning, bs engineering, bs eng

Contact Information:

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